EN
モデル: 4-1
ブランド: JCB
JCB JGDMシリーズ一般的なダイヤモンドミクロンパウダーは、幅広い研削、ラッピング、および研磨用途向けに設計された費用対効果が高く、高性能の合成ダイヤモンド研磨剤です。高品質のラボ栽培ダイヤモンド単結晶から導出されたこれらのミクロン粉末は、精密段階で、鋭利なエッジ、良好な熱安定性、一貫した粒子形態を特徴としています。
汎用の研磨剤として、JGDMは樹脂、金属、電気抑制された結合システムへの統合、およびペーストとスラリーの研磨に最適です。業界全体での強力な適応性により、ダイヤモンド切削工具、光学コンポーネント、および超ハード表面仕上げのメーカーにとって主食です。
詳細： https：//en.jcbdiamond.com/
ブロック状または半ブロックの粒子形状、強度とシャープネスのバランスを提供する
安定した切断能力と優れた自己鋭い特性
0〜0.25μmから40〜60μmまで利用可能な、緊密に制御されたサイズ分布
熱および化学の安定性が高く、湿った粉砕および乾燥粉砕条件に適しています
樹脂、金属、電気めっきシステムなど、さまざまなツールボンディング方法と互換性があります
タングステン炭化物、陶器、石、光学ガラス、硬い合金の研削と研磨
樹脂結合ダイヤモンド切削工具：粉砕ホイールとセグメントに最適なフィラー材料
ダイヤモンドのスラリーとペースト：半導体、レンズ、ハードディスクの精度研磨で使用
ツール製造：PCD焼結および多結晶スーパーハード材料の生産のためのベース材料として
一般的な表面仕上げ：機械シール生産、カビ成分、航空宇宙部品に適用されます
Ultra-Fine CVDダイヤモンドまたは特殊な研磨剤と比較して、 JGDMシリーズは、競争力のあるパフォーマンスを維持しながら、製剤とアプリケーションの柔軟性を高めます。精度および産業部門全体で日常使用の研磨剤のコストと効率のギャップを埋めます。
重要なコンポーネントの仕上げを強化するか、ダイヤモンド切削工具の性能を向上させるかにかかわらず、 JCB一般的なダイヤモンドミクロンパウダーは、信頼性が高く、スケーラブルで経済的な結果をもたらします。これは、単結晶スーパーハード材料とラボ栽培ダイヤモンド技術の実証済みの強度に基づいて構築された優れたオールラウンド研磨ソリューションです。
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ACM Features: Utilizes premium resin-bonded diamond JBD6(AC6) as raw material, processed through advanced manufacturing techniques including crushing, shaping, purification, and grading. The product is light gray, has a regular crystalline shape, low impurity content, low magnetism, excellent self-sharpening properties, a polycrystalline-like structure, and precise control over shape and particle size distribution. Applications: Suitable for the production of resin-bonded abrasives, grinding pastes, and grinding fluids, used in precision polishing of hard alloys, optical glass, and areas requiring extremely high product quality. |
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JGDM-D Features: Made from high-quality resin-bonded diamond JRD, processed through advanced manufacturing methods involving crushing, shaping, purification, and grading. The product is light yellow-green, has a relatively regular crystal shape, low impurity content, good self-sharpening properties, and uniform particle size distribution. Applications: Ideal for resin-bonded, ceramic-bonded abrasives, grinding pastes, and fluids. Used in polishing gemstones, stone, ceramic tiles, glass, optical glass, and hard alloys. An economical resin diamond micro powder with high grinding efficiency and wear resistance. |
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JGDM-C Features: A general-purpose powder, made from high-quality single-crystal synthetic diamond JSD10. Processed using advanced technology, including crushing, shaping, purification, and grading. The product is light yellow, has a relatively regular crystal form, low impurity content, low magnetism, and even particle size distribution. Applications: Suited for metal-bonded, ceramic-bonded, and resin-bonded abrasives, grinding pastes, and fluids. Used in polishing gemstones, glass, optical glass, ceramics, stone, PCD/PCBN, and other non-metallic materials. |
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JGDM-B Features: A high-strength powder, made from premium single-crystal diamond JSD20. Processed through advanced techniques involving crushing, shaping, purification, and grading. The product is light yellow, has a regular crystal shape, low impurity content, low magnetism, and a concentrated particle size distribution. Applications: For metal-bonded, ceramic-bonded abrasives, electroplated tools, grinding pastes, and fluids. Used in the production of precision grinding wheels for optical glass, fine grinding pellets, edge grinding wheels, precision polishing discs, sapphire precision grinding wheels for silicon materials, precision processing tools for gems and jade, and wire saws for slicing monocrystalline silicon and sapphire. |
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JGDM-A Features: A high-strength powder, made from high-strength premium single-crystal diamond JSD30. Processed through advanced manufacturing techniques including crushing, shaping, purification, and grading. The product is light yellow, has a regular crystal shape, extremely low impurity content, low magnetism, a concentrated particle size distribution, high strength, excellent dispersion, and wear resistance. Applications: Suitable for metal-bonded tools, ceramic-bonded tools, and various electroplated tools. Used in cutting, grinding, and polishing of organic and inorganic brittle materials. Applications include wire saws for slicing monocrystalline silicon and sapphire, precision cutting blades for gems and semiconductors, as well as precision grinding and polishing tools for single crystal silicon, polysilicon, diamonds, gems, sapphires, quartz wafers, LED sapphire substrates, liquid crystal glass, high-precision magnetic materials, semiconductors, and other advanced materials. |
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