EN
EN
モデル: 4-1
ブランド: ジェーシービー
一般ダイヤモンドミクロンパウダー（JGDMシリーズ – 多用途合成ダイヤモンド砥粒）
JCB JGDM シリーズ一般ダイヤモンドミクロンパウダーは、手頃な価格の高性能合成ダイヤモンド研磨材です。多くの研削、ラッピング、研磨作業に使用されます。高品質のラボ グロウン ダイヤモンド結晶から作られたこの粉末は慎重に選別され、鋭いエッジ、優れた耐熱性、均一な粒子形状を備えています。
詳細はこちら： https://ja.jcbdiamond.com/
主な特長
ブロック状または半ブロック状の形状、強度とシャープネスのバランス
良好な自生刃付きで安定した切れ味
厳密なサイズ制御、0 ～ 0.25 μm から 40 ～ 60 μm まで利用可能
高い耐熱性と耐薬品性、湿式または乾式研削で使用可能
樹脂、金属、電気メッキボンドなどのさまざまなボンディング方法に対応
アプリケーション
超硬、セラミックス、石材、光学ガラス、超硬合金などの研削・研磨
レジンボンドダイヤモンドツール：砥石・セグメント用フィラー
ダイヤモンドのスラリーとペースト: 半導体、レンズ、ハードディスクの精密研磨用
工具製作： PCD焼結用母材および超硬材料
一般的な表面仕上げ：メカニカルシール、金型部品、航空宇宙部品に使用
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ACM Features: Utilizes premium resin-bonded diamond JBD6(AC6) as raw material, processed through advanced manufacturing techniques including crushing, shaping, purification, and grading. The product is light gray, has a regular crystalline shape, low impurity content, low magnetism, excellent self-sharpening properties, a polycrystalline-like structure, and precise control over shape and particle size distribution. Applications: Suitable for the production of resin-bonded abrasives, grinding pastes, and grinding fluids, used in precision polishing of hard alloys, optical glass, and areas requiring extremely high product quality. |
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JGDM-D Features: Made from high-quality resin-bonded diamond JRD, processed through advanced manufacturing methods involving crushing, shaping, purification, and grading. The product is light yellow-green, has a relatively regular crystal shape, low impurity content, good self-sharpening properties, and uniform particle size distribution. Applications: Ideal for resin-bonded, ceramic-bonded abrasives, grinding pastes, and fluids. Used in polishing gemstones, stone, ceramic tiles, glass, optical glass, and hard alloys. An economical resin diamond micro powder with high grinding efficiency and wear resistance. |
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JGDM-C Features: A general-purpose powder, made from high-quality single-crystal synthetic diamond JSD10. Processed using advanced technology, including crushing, shaping, purification, and grading. The product is light yellow, has a relatively regular crystal form, low impurity content, low magnetism, and even particle size distribution. Applications: Suited for metal-bonded, ceramic-bonded, and resin-bonded abrasives, grinding pastes, and fluids. Used in polishing gemstones, glass, optical glass, ceramics, stone, PCD/PCBN, and other non-metallic materials. |
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JGDM-B Features: A high-strength powder, made from premium single-crystal diamond JSD20. Processed through advanced techniques involving crushing, shaping, purification, and grading. The product is light yellow, has a regular crystal shape, low impurity content, low magnetism, and a concentrated particle size distribution. Applications: For metal-bonded, ceramic-bonded abrasives, electroplated tools, grinding pastes, and fluids. Used in the production of precision grinding wheels for optical glass, fine grinding pellets, edge grinding wheels, precision polishing discs, sapphire precision grinding wheels for silicon materials, precision processing tools for gems and jade, and wire saws for slicing monocrystalline silicon and sapphire. |
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JGDM-A Features: A high-strength powder, made from high-strength premium single-crystal diamond JSD30. Processed through advanced manufacturing techniques including crushing, shaping, purification, and grading. The product is light yellow, has a regular crystal shape, extremely low impurity content, low magnetism, a concentrated particle size distribution, high strength, excellent dispersion, and wear resistance. Applications: Suitable for metal-bonded tools, ceramic-bonded tools, and various electroplated tools. Used in cutting, grinding, and polishing of organic and inorganic brittle materials. Applications include wire saws for slicing monocrystalline silicon and sapphire, precision cutting blades for gems and semiconductors, as well as precision grinding and polishing tools for single crystal silicon, polysilicon, diamonds, gems, sapphires, quartz wafers, LED sapphire substrates, liquid crystal glass, high-precision magnetic materials, semiconductors, and other advanced materials. |
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